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C00354 - SEMI C3.54 - シラン(SiH4)のガス純度ガイドライン StdTpc-Process Chemicals - Bases SEMI C27-0708 (technical revision)

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Description

SEMI C27-0708 (technical revision)

and 150 mm diameter wafers

This Guide define acceptable CMP criteria of TSV in terms of dishing

temporary carrier bonding

that has the following capabilities

C00354 - SEMI C3.54 - シラン(SiH4)のガス純度ガイドライン StdTpc-Process Chemicals - Bases SEMI C27-0708 (technical revision)global Gases Technical Committee2011912global Audits and Reviews Subcommittee201110www. semiviews. org www. semi. org199720069 : 2011 Referenced SEMI Standards None.

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