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but they may also be applied to wafers of other materials
a scanning solution for collecting metal contamination from wafer surfaces is recommended for using the solution compositions optimized by ensuring recovery rate with 75%–125% (see ¶¶ 5
originally published March 2004
4-1022 (Reapproved 0225)
SEMI E5-0708 (technical revision)
F00700 - SEMI F7 - フロロカーボン製チューブフィッティング接合部の引張り強さを測定するテスト方法 StdTpc-Package Specifications but they may also beFacilities CommitteeNorth American Facilities Committee199810North American Regional Standards Committee19992SEMI On Line199921992 NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. SIU. S. Referenced SEMI Standards None.
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