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This Test Method is suitable for referee measurement purposes and may be used for routine acceptance measurements when specified limits require test precision greater than can be obtained with hand held scale and unaided eye
SEMI PV18-0912 (technical revision)
SEMI M38 — Specification for Polished Reclaimed Silicon Wafers
特定のウェーハの重要なパラメータを記載した発注書の様式の項の1つではあるが，そのウェーハの仕様書の発注書に記載されていない項に責任があるグループからの新たな追加を要求する方法。
This Document provides guidance for specifying edge trimming and resultant particle count to ensure the successful wafer thinning process after the wafer edge trimming
P00200 - SEMI P2 - ハードサーフェス・フォトマスク用クロムブランク Revision:SEMI P2-0308 - Inactive This Test Method is suitableNOTICE: This translation is a REFERENCE COPY ONLY. If differences should exist between the English version and a translation in any other language, the English version is the official and authoritative version. SEMI SEMI global Micropatterning Committee2008118global Audits and Reviews Subcommittee20082www. semi. org1998 NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met.
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