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to be published July 2001
as demonstrated by a recent IRDS study
Participants will become familiar with many of the codes governing hazardous waste management
it can be applied to circular silicon wafers or substrates of any diameter and thickness that can be handled without breaking
definition and interpretation of each term provides material characteristics used for Flat Panel Display (FPD) manufacturing
Leadframe and Substrate Package Assembly Process StdDcs- to be published July 2001Course Description This course provides an overview of the leadframe and substrate package assembly processes. It provides an overview of the leadframe and substrate material before diving into the package assembly processes. The assembly processes of QFP leadframe and flip chip BGA package from wire bond, die attach, and flip chip to package singulation will be shared in this course. Course Objectives Identify the materials in the leadframe and rigid